8.Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Compared with ENIG, the ENEPIG is added a layer of palladium between nickel and gold. Palladium can avoid the corrosion caused by the substitution reaction, and make full preparation for the immersion gold.
Merits: Suitable for lead-free soldering.The surface is very smooth and suitable for SMT. Storage conditions are not harsh.Suitable for electrical testing.Suitable for switch contact design.Suitable for aluminum wire binding, suitable for thick board, good resistance to environmental attack.
Demerits: Higher cost.
The changes of PCB surface finish typies are not very big, but we should be noted that the PCB surface finish will definitely change in the future,because of the tough environment and energy efficiency targets are getting more and more attention.
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